Amplitech AGMDC
Peak performance starts here.
Overview
Every performance claim AmpliTech makes starts here. AGMDC—AmpliTech Group’s Microwave Design Center—is where our proprietary MMIC chips are designed. The integrated circuits that determine noise performance before a single finished product leaves the factory. Most RF manufacturers design around available components. AGMDC designs the components themselves.
That distinction, engineering at the chip level rather than the system level, is what makes our performance numbers possible. And what makes them difficult for competitors to replicate.
What AGMDC builds
Proprietary MMIC designs.
LNA amplifiers, filters, attenuators, and power amplifiers covering frequencies from 2 GHz through millimeter-wave. Every design optimized for its specific application — not adapted from a general-purpose component, not sourced from a third-party foundry.
Performance across every application AmpliTech serves.
AGMDC designs are at work inside AmpliTech’s 5G ORAN radios, defense and aerospace systems, satellite ground station LNBs, space-borne platforms, and quantum computing hardware. Space-qualified designs meet the demands of LEO and MEO satellite programs. Cryogenic designs support operation at 4 Kelvin for quantum computing applications.
Part of the domestic semiconductor ecosystem.
AGMDC is a member of the Texoma Semiconductor Tech Hub — an SMU-led initiative strengthening semiconductor innovation and manufacturing capability across North Texas and Southern Oklahoma. As U.S. domestic chip manufacturing capacity expands, AGMDC is positioned to grow with it.
External design services.
AGMDC’s capabilities are available beyond AmpliTech’s own product lines. OEMs and system integrators requiring custom MMIC design for advanced RF applications — in defense, telecommunications, space, or emerging technology — can engage AGMDC’s engineering team directly.




From the Chip to the Cell Tower
Five divisions, one company. Every product we build draws on the full depth of AmpliTech, from chip design to final assembly to deployment.
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